A method of inspecting a connection joint including a first side coupled to an opposite second side along a bond, extending along an edge. The method includes generating at least one first sound wave at a first location on the first side, wherein the first location is at a first distance from the edge. The method also includes receiving the at least one first sound wave at a plurality of sensors coupled to the second side and determining that the bond is present at the first location. The method further includes generating at least one second sound wave at a second location on the first side, wherein the second location is offset a predetermined distance from the first location. The method also includes receiving the at least one second sound wave at the plurality of sensors and determining a width of the bond.