Invention Grant
- Patent Title: Computer subsystem and computer system with composite nodes in an interconnection structure
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Application No.: US15150419Application Date: 2016-05-09
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Publication No.: US09880972B2Publication Date: 2018-01-30
- Inventor: Jiangen Liu , Chenghong He , Haibin Wang , Xinyu Hou
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Huawei Technologies Co., Ltd.
- Main IPC: G06F9/30
- IPC: G06F9/30 ; G06F15/80 ; G06F15/173 ; G06F15/167 ; G06F13/42

Abstract:
The present invention provides a computer subsystem and a computer system. The computer subsystem includes L composite nodes, each composite node includes M basic nodes, each basic node includes N central processing units (CPUs) and one node controller. Any two CPUs in each basic node are interconnected. Each CPU in each basic node is connected to the node controller in the basic node. The node controller in each basic node has a routing function. Any two node controllers in the M basic nodes are interconnected. A connection between the L composite nodes formed through connections between node controllers enables communication between any two node controllers to be no more than three hops. The computer subsystem and the computer system according to embodiments of the present invention can reduce the kinds and the number of interconnection chips, and simplify an interconnection structure of a system, thereby improving reliability of the system.
Public/Granted literature
- US20160328357A1 COMPUTER SUBSYSTEM AND COMPUTER SYSTEM WITH COMPOSITE NODES IN AN INTERCONNECTION STRUCTURE Public/Granted day:2016-11-10
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