Invention Grant
- Patent Title: Apparatus for manufacturing semiconductor package and method for manufacturing semiconductor package using the same
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Application No.: US14983524Application Date: 2015-12-29
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Publication No.: US09881814B2Publication Date: 2018-01-30
- Inventor: Seungjin Cheon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2015-0021635 20150212
- Main IPC: H01L21/56
- IPC: H01L21/56 ; B29C45/34 ; B29C33/10 ; B29L31/34

Abstract:
The inventive concepts provide an apparatus for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same. The apparatus includes a mold unit with a cavity formed by an inner space of the mold unit. The mold unit includes a first mold, a second mold coupled to the first mold, a supply part supplying a molding resin into the cavity, and a vent part disposed to be opposite to the supply part. The vent part includes a first vent part fixed in the mold unit, and a second vent part movable with respect to the first vent part.
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Information query
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