公开(公告)号：US11776946B2

公开(公告)日：2023-10-03

申请号：US17224520

申请日：2021-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junho Cho ,  Ohchul Kwon ,  Seungjin Cheon ,  Tea-Geon Kim ,  Bubryong Lee ,  Junglae Jung

IPC: H01L25/00 ,  H01L23/00 ,  H01L25/18 ,  H01L23/538 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/565 ,  H01L23/5385 ,  H01L24/09 ,  H01L24/17 ,  H01L24/32 ,  H01L24/46 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L24/92 ,  H01L25/18 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L2224/13101 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92225 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.

公开(公告)号：US09881814B2

公开(公告)日：2018-01-30

申请号：US14983524

申请日：2015-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungjin Cheon

IPC: H01L21/56 ,  B29C45/34 ,  B29C33/10 ,  B29L31/34

CPC classification number: H01L21/565 ,  B29C33/10 ,  B29C45/34 ,  B29L2031/3406 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: The inventive concepts provide an apparatus for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same. The apparatus includes a mold unit with a cavity formed by an inner space of the mold unit. The mold unit includes a first mold, a second mold coupled to the first mold, a supply part supplying a molding resin into the cavity, and a vent part disposed to be opposite to the supply part. The vent part includes a first vent part fixed in the mold unit, and a second vent part movable with respect to the first vent part.

公开(公告)号：US08981543B2

公开(公告)日：2015-03-17

申请号：US13951376

申请日：2013-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heungkyu Kwon ,  Seungjin Cheon

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H01L23/28 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/565 ,  H01L23/13 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Semiconductor packages are disclosed. In a semiconductor package, a package board may include a hole. A mold layer may cover an upper portion of the package board and extend through the hole to cover at least a portion of a bottom surface of the package board. Each of the sidewalls of a lower mold portion may have a symmetrical structure with respect to the hole penetrating the package board, such that a warpage phenomenon of the semiconductor package may be reduced.

Abstract translation: 公开了半导体封装。 在半导体封装中，封装板可以包括孔。 模具层可以覆盖封装板的上部并且延伸穿过孔以覆盖封装板的底表面的至少一部分。 下模具部分的每个侧壁可以具有相对于穿过封装板的孔的对称结构，从而可以减少半导体封装的翘曲现象。