Invention Grant
- Patent Title: Semiconductor package, semiconductor device using the same and manufacturing method thereof
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Application No.: US15162724Application Date: 2016-05-24
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Publication No.: US09881902B2Publication Date: 2018-01-30
- Inventor: Wen-Sung Hsu , Shih-Chin Lin , Tao Cheng
- Applicant: MEDIATEK Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L25/065 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/538 ; H01L25/10 ; H01L25/00 ; H01L21/52
Abstract:
A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first electronic component is disposed on the substrate. The first pillar layer connects the first conductive layer and the substrate. The first package body encapsulates the first conductive layer, the first pillar layer and the first electronic component. The first conductive layer is embedded in the first package body.
Public/Granted literature
- US20170040292A1 SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-02-09
Information query
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