Invention Grant
- Patent Title: Chip package and method of manufacturing the same
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Application No.: US14819348Application Date: 2015-08-05
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Publication No.: US09881959B2Publication Date: 2018-01-30
- Inventor: Po-Shen Lin , Chia-Sheng Lin , Yi-Ming Chang
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: TW103127799A 20140813
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A method of manufacturing chip package includes providing a semiconductor substrate having at least a photo diode and an interconnection layer. The interconnection layer is disposed on an upper surface of the semiconductor substrate and above the photo diode and electrically connected to the photo diode. At least a redistribution circuit is formed on the interconnection layer. The redistribution circuit is electrically connected to the interconnection layer. A packaging layer is formed on the redistribution circuit. Subsequently, a carrier substrate is attached to the packaging layer. A color filter is formed on a lower surface of the semiconductor substrate. A micro-lens module is formed under the color filter. The carrier substrate is removed.
Public/Granted literature
- US20160049436A1 CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-02-18
Information query
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