Invention Grant
- Patent Title: Biometric sensor chip having distributed sensor and control circuitry
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Application No.: US15181229Application Date: 2016-06-13
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Publication No.: US09883822B2Publication Date: 2018-02-06
- Inventor: Milind S. Bhagavat , Jun Zhai
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: G06K9/00
- IPC: G06K9/00 ; A61B5/117 ; A61B5/1172 ; A61B5/053 ; H01L27/146

Abstract:
A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.
Public/Granted literature
- US20160278671A1 Biometric Sensor Chip Having Distributed Sensor and Control Circuitry Public/Granted day:2016-09-29
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