Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15334411Application Date: 2016-10-26
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Publication No.: US09887202B2Publication Date: 2018-02-06
- Inventor: Hyun-Min Choi , Shigenobu Maeda , Jihoon Yoon , Sungman Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0133074 20131104
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/112 ; H01L29/06 ; H01L29/423 ; H01L23/522 ; H01L23/525 ; H01L27/02

Abstract:
The inventive concepts provide semiconductor devices and methods of manufacturing the same. One semiconductor device includes a substrate, a device isolation layer disposed on the substrate, a fin-type active pattern defined by the device isolation layer and having a top surface higher than a top surface of the device isolation layer, a first conductive line disposed on an edge portion of the fin-type active pattern and on the device isolation layer adjacent to the edge portion of the fin-type active pattern, and an insulating thin layer disposed between the fin-type active pattern and the first conductive line. The first conductive line forms a gate electrode of an anti-fuse that may be applied with a write voltage.
Public/Granted literature
- US20170047335A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-02-16
Information query
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