Invention Grant
- Patent Title: Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads
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Application No.: US14289153Application Date: 2014-05-28
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Publication No.: US09890306B2Publication Date: 2018-02-13
- Inventor: Yanjia Zuo , Mandakini Kanungo , Hong Zhao , John R. Andrews , Pratima Gattu Naga Rao , Mark A. Cellura , Santokh S. Badesha
- Applicant: XEROX CORPORATION
- Applicant Address: US CT Norwalk
- Assignee: XEROX CORPORATION
- Current Assignee: XEROX CORPORATION
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: C09J163/04
- IPC: C09J163/04 ; C09J163/00 ; C09J7/00 ; C09J7/02 ; B32B27/38 ; B32B27/26 ; B32B27/20
Abstract:
An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.
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