Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
-
Application No.: US14987294Application Date: 2016-01-04
-
Publication No.: US09893060B2Publication Date: 2018-02-13
- Inventor: Che-Cheng Chang , Chih-Han Lin , Horng-Huei Tseng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor device includes a substrate, a core device, and an input/output (I/O) device. The core device is disposed on the substrate. The core device includes a first gate electrode having a bottom surface and at least one sidewall. The bottom surface of the first gate electrode and the sidewall of the first gate electrode intersect to form a first interior angle. The I/O device is disposed on the substrate. The I/O device includes a second gate electrode having a bottom surface and at least one sidewall. The bottom surface of the second gate electrode and the sidewall of the second gate electrode intersect to form a second interior angle greater than the first interior angle of the first gate electrode.
Public/Granted literature
- US20170179117A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-06-22
Information query
IPC分类: