Invention Grant
- Patent Title: Semiconductor package with cantilever pads
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Application No.: US14582581Application Date: 2014-12-24
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Publication No.: US09899236B2Publication Date: 2018-02-20
- Inventor: Jefferson Talledo , Godfrey Dimayuga
- Applicant: STMicroelectronics, Inc.
- Applicant Address: PH Calamba
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: PH Calamba
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: G01R31/20
- IPC: G01R31/20 ; H01L21/48 ; H01L23/498
Abstract:
One or more embodiments are directed to semiconductor packages with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.
Public/Granted literature
- US20160190031A1 SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS Public/Granted day:2016-06-30
Information query
