Invention Grant
- Patent Title: Method of forming layout design
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Application No.: US15150149Application Date: 2016-05-09
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Publication No.: US09899263B2Publication Date: 2018-02-20
- Inventor: Tung-Heng Hsieh , Chung-Te Lin , Sheng-Hsiung Wang , Hui-Zhong Zhuang , Min-Hsiung Chiang , Ting-Wei Chiang , Li-Chun Tien
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L21/8234 ; H01L27/02 ; H01L21/304 ; H01L29/66 ; H01L21/3213 ; H01L27/118

Abstract:
A method of forming a layout design for fabricating an integrated circuit (IC) is disclosed. The method includes identifying one or more areas in the layout design occupied by one or more segments of a plurality of gate structure layout patterns of the layout design; and generating a set of layout patterns overlapping the identified one or more areas. The plurality of gate structure layout patterns has a predetermined pitch smaller than a spatial resolution of a predetermined lithographic technology. A first layout pattern of the set of layout patterns has a width less than twice the predetermined pitch.
Public/Granted literature
- US20160254190A1 Method of Forming Layout Design Public/Granted day:2016-09-01
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