Invention Grant
- Patent Title: Semiconductor device packages with improved thermal management and related methods
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Application No.: US15401762Application Date: 2017-01-09
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Publication No.: US09899293B2Publication Date: 2018-02-20
- Inventor: Steven Groothuis , Jian Li , Shijian Luo
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; H01L23/367 ; H01L25/065 ; H01L21/56 ; H01L23/48 ; H01L21/48

Abstract:
Semiconductor device packages in accordance with this disclosure may include a substrate and a stack of semiconductor dice attached to the substrate. An uppermost semiconductor die of the stack of semiconductor dice located on a side of the stack of semiconductor dice opposite the substrate may be a heat-generating component configured to generate more heat than each other semiconductor die of the stack of semiconductor dice. Electrical connectors may extend directly from the uppermost semiconductor die to the substrate. A heat sink may be located on a side of the uppermost semiconductor die opposite the substrate. A passivation material may be located between the uppermost semiconductor die and the heat sink.
Public/Granted literature
- US20170117205A1 SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND RELATED METHODS Public/Granted day:2017-04-27
Information query
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