Invention Grant
- Patent Title: Three-helix bundle protein and use thereof
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Application No.: US15137942Application Date: 2016-04-25
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Publication No.: US09902758B2Publication Date: 2018-02-27
- Inventor: Dongkyu Shin , Jung Min Kim , Kyoung Hu Lee , Jae Il Lee , Jung Wook Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2015-0057295 20150423
- Main IPC: A61K38/00
- IPC: A61K38/00 ; A61P35/00 ; C07K14/47
Abstract:
A three-helix bundle protein, a polynucleotide encoding the three-helix bundle protein, a method of preparing the three-helix bundle protein, and a method of treating a cancer using the three-helix bundle protein.
Public/Granted literature
- US20160311878A1 THREE-HELIX BUNDLE PROTEIN AND USE THEREOF Public/Granted day:2016-10-27
Information query
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