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公开(公告)号：US09902758B2
公开(公告)日：2018-02-27
申请号：US15137942
申请日：2016-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongkyu Shin , Jung Min Kim , Kyoung Hu Lee , Jae Il Lee , Jung Wook Lee
CPC classification number: C07K14/4746 , A61K38/00 , C07K14/47 , C07K14/4702 , C07K2319/00
Abstract: A three-helix bundle protein, a polynucleotide encoding the three-helix bundle protein, a method of preparing the three-helix bundle protein, and a method of treating a cancer using the three-helix bundle protein.
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公开(公告)号：US20160311878A1
公开(公告)日：2016-10-27
申请号：US15137942
申请日：2016-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongkyu Shin , Jung Min Kim , Kyoung Hu Lee , Jae Il Lee , Jung Wook Lee
IPC: C07K14/47
CPC classification number: C07K14/4746 , A61K38/00 , C07K14/47 , C07K14/4702 , C07K2319/00
Abstract: A three-helix bundle protein, a polynucleotide encoding the three-helix bundle protein, a method of preparing the three-helix bundle protein, and a method of treating a cancer using the three-helix bundle protein.
Abstract translation: 三螺旋束蛋白，编码三螺旋束蛋白的多核苷酸，制备三螺旋束蛋白的方法，以及使用三螺旋束蛋白治疗癌症的方法。
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公开(公告)号：US20150094271A1
公开(公告)日：2015-04-02
申请号：US14502088
申请日：2014-09-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hoon Lee , Eunji Kang , Hye Yoon Kang , Dongkyu Shin , Jae Il Lee , Jieun Han , Jung Min Lee
IPC: C07K14/47 , C12N7/00 , C07K14/005
CPC classification number: C12N7/00 , A61K38/00 , C07K14/4746 , C07K2319/10 , C07K2319/73
Abstract: A leucine zipper variant, a polynucleotide encoding the leucine zipper variant, a method of preparing a leucine zipper variant, a method of inhibiting HDM2- and/or HDMX using the leucine zipper variant, and a method of the prevention and/or treatment of cancer using the leucine zipper variant.
Abstract translation: 亮氨酸拉链变体，编码亮氨酸拉链变体的多核苷酸，制备亮氨酸拉链变体的方法，使用亮氨酸拉链变体抑制HDM2-和/或HDMX的方法，以及预防和/或治疗癌症的方法 使用亮氨酸拉链变体。
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公开(公告)号：US20250054735A1
公开(公告)日：2025-02-13
申请号：US18595009
申请日：2024-03-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Wookhyeon Kwon , Minnhoo Choi , Songyun Kang , Yongwoo Kim , Jaehyun Kim , Hansol Kim , Chulwoo Park , Jaehyun Soh , Dongkyu Shin , Deukho Lee , Hoontaek Lee , Junghyun Cho , Yangyeon Chu , Kaan Uzun
IPC: H01J37/32
Abstract: A system is described for protecting the edge region of a substrate during a plasma process. The system includes an outer ring with a plurality of outer uneven portions and an inner ring also with a plurality of inner uneven portions. The outer ring covers the edge region of the substrate. The inner ring may rotate around the center point of the outer ring. When the inner ring is rotated, each of the inner uneven portions and each the outer uneven portions may slide by each other to overlap and to form openings. Changes of the opening ratios in the gaps (or the overlap ratios of the inner and outer uneven portions) may change a thickness of a plasma sheath. Thus, the plasma sheath in an edge region of the substrate may be readily controlled.
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公开(公告)号：US20240282586A1
公开(公告)日：2024-08-22
申请号：US18640481
申请日：2024-04-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chanyeong Jeong , Hoseop Choi , Sunggil Kang , Dongkyu Shin , Sangjin An
IPC: H01L21/324 , H01J37/32 , H01L21/311 , H01L21/67
CPC classification number: H01L21/324 , H01J37/321 , H01J37/32229 , H01J37/3244 , H01J37/32522 , H01J37/32724 , H01L21/31116 , H01L21/67069 , H01L21/67109
Abstract: A wafer processing method includes supplying a first process gas into a wafer processing apparatus, lowering a temperature of the wafer, generating plasma using the first process gas, supplying a second process gas and mixing the second process gas with the plasma, performing a plasma process on the wafer using the plasma and the second process gas, and performing an annealing process on the wafer on which the plasma process has been performed. The lowering of the temperature of the wafer includes increasing an internal pressure of the wafer processing apparatus.
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Patent Agency Ranking
公开(公告)号：US11990348B2
公开(公告)日：2024-05-21
申请号：US17184279
申请日：2021-02-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chanyeong Jeong , Hoseop Choi , Sunggil Kang , Dongkyu Shin , Sangjin An
IPC: H01L21/3065 , H01J37/32 , H01L21/311 , H01L21/324 , H01L21/67
CPC classification number: H01L21/324 , H01J37/321 , H01J37/32229 , H01J37/3244 , H01J37/32522 , H01J37/32724 , H01L21/31116 , H01L21/67069 , H01L21/67109
Abstract: A wafer processing method includes supplying a first process gas into a wafer processing apparatus, lowering a temperature of the wafer, generating plasma using the first process gas, supplying a second process gas and mixing the second process gas with the plasma, performing a plasma process on the wafer using the plasma and the second process gas, and performing an annealing process on the wafer on which the plasma process has been performed. The lowering of the temperature of the wafer includes increasing an internal pressure of the wafer processing apparatus.
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公开(公告)号：US20150329847A1
公开(公告)日：2015-11-19
申请号：US14716275
申请日：2015-05-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jae Il Lee , Hye Yoon Kang , Dongkyu Shin , Jung Min Kim , Jungmin Lee
CPC classification number: A61K38/03 , A61K38/00 , A61K38/482 , A61K39/3955 , C07K4/00 , C07K16/2863 , C07K2318/20 , C07K2319/00 , C07K2319/01 , C07K2319/035 , C07K2319/33 , C07K2319/50 , C07K2319/70 , C12N9/6467 , C12Y304/21079
Abstract: A fusion protein including granzyme B, a cell penetrating peptide, a cleavage site, and a targeting moiety, a composition for cell membrane penetration comprising the fusion protein, and an anticancer composition comprising the fusion protein.
Abstract translation: 包含粒酶B，细胞穿透肽，切割位点和靶向部分的融合蛋白，包含融合蛋白的细胞膜渗透用组合物和包含该融合蛋白的抗癌组合物。
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公开(公告)号：US11195696B2
公开(公告)日：2021-12-07
申请号：US16850252
申请日：2020-04-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongkyu Shin , Sangki Nam , Soonam Park , Akira Koshiishi , Kyuhee Han
IPC: H01J37/32 , H01L21/67 , H01L21/683 , H01L21/3065 , H01J37/063
Abstract: An electron beam generator, a plasma processing apparatus, and a plasma processing method, the electron beam generator including a side insulator configured to surround the substrate support, the side insulator having an electron beam chamber therein; a first electrode embedded in the side insulator and adjacent to a first side wall of the electron beam chamber; a second electrode on a second side wall of the electron beam chamber; and a guide in an outlet of the electron beam chamber, the guide including slits through which electron beams generated in the electron beam chamber are transmittable into the process chamber.
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公开(公告)号：US09724378B2
公开(公告)日：2017-08-08
申请号：US14716275
申请日：2015-05-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jae Il Lee , Hye Yoon Kang , Dongkyu Shin , Jung Min Kim , Jungmin Lee
CPC classification number: A61K38/03 , A61K38/00 , A61K38/482 , A61K39/3955 , C07K4/00 , C07K16/2863 , C07K2318/20 , C07K2319/00 , C07K2319/01 , C07K2319/035 , C07K2319/33 , C07K2319/50 , C07K2319/70 , C12N9/6467 , C12Y304/21079
Abstract: A fusion protein including granzyme B, a cell penetrating peptide, a cleavage site, and a targeting moiety, a composition for cell membrane penetration comprising the fusion protein, and an anticancer composition comprising the fusion protein.
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公开(公告)号：US09365833B2
公开(公告)日：2016-06-14
申请号：US14502088
申请日：2014-09-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hoon Lee , Eunji Kang , Hye Yoon Kang , Dongkyu Shin , Jae Il Lee , Jieun Han , Jung Min Lee
CPC classification number: C12N7/00 , A61K38/00 , C07K14/4746 , C07K2319/10 , C07K2319/73
Abstract: A leucine zipper variant, a polynucleotide encoding the leucine zipper variant, a method of preparing a leucine zipper variant, a method of inhibiting HDM2- and/or HDMX using the leucine zipper variant, and a method of the prevention and/or treatment of cancer using the leucine zipper variant.
Abstract translation: 亮氨酸拉链变体，编码亮氨酸拉链变体的多核苷酸，制备亮氨酸拉链变体的方法，使用亮氨酸拉链变体抑制HDM2-和/或HDMX的方法，以及预防和/或治疗癌症的方法 使用亮氨酸拉链变体。
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