发明授权
- 专利标题: Package assembly
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申请号: US15165719申请日: 2016-05-26
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公开(公告)号: US09906157B2公开(公告)日: 2018-02-27
- 发明人: Chad-Yao Tan , Da-Jung Chen
- 申请人: Delta Electronics Int'l (Singapore) Pte Ltd
- 申请人地址: SG Singapore
- 专利权人: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- 当前专利权人: DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- 当前专利权人地址: SG Singapore
- 代理机构: Kirton McConkie
- 代理商 Evan R. Witt
- 优先权: SG10201504274S 20150529
- 主分类号: H02M7/00
- IPC分类号: H02M7/00 ; H01L23/053 ; H01L21/48 ; H01L23/00
摘要:
A package assembly includes a main body, a power module and replaceable top cover. The main body has a hollow part. The power module is disposed within a hollow part of the main body and located beside the bottom part of the main body. At least one first pin is disposed on a surface of the power module. The at least one first pin is accommodated within the hollow part of the main body and partially protruded out of a first open end of the hollow part near a top part of the main body. The top cover is disposed in the hollow part of the main body, and includes at least one first opening corresponding to the at least one first pin. The at least one first pin is penetrated through the corresponding first opening and exposed outside the first open end of the hollow part.
公开/授权文献
- US20160352245A1 PACKAGE ASSEMBLY 公开/授权日:2016-12-01
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