- 专利标题： Cured thermoset for high thermal conductive materials
-
申请号： US15108794申请日： 2013-12-30
-
公开(公告)号： US09908988B2公开(公告)日： 2018-03-06
- 发明人: Wei Liu , Xiaomei Song , Hongyu Chen , Yan Huang , Yu Zhang
- 申请人： Dow Global Technologies LLC , Rohm and Haas Company
- 申请人地址： US MI Midland US PA Philadelphia
- 专利权人： Dow Global Technologies LLC,Rohm and Haas Company
- 当前专利权人： Dow Global Technologies LLC,Rohm and Haas Company
- 当前专利权人地址： US MI Midland US PA Philadelphia
- 代理商 S. Matthew Cairns
- 国际申请： PCT/CN2013/090956 WO 20131230
- 国际公布： WO2015/100555 WO 20150709
- 主分类号： C08K3/28
- IPC分类号： C08K3/28 ; C08L63/00 ; H01L33/64 ; H01L23/373 ; C08K3/22 ; C08K5/435 ; C08G59/24 ; C08G59/50
摘要：
An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.
公开/授权文献
- US20160326339A1 CURED THERMOSET FOR HIGH THERMAL CONDUCTIVE MATERIALS 公开/授权日：2016-11-10
信息查询
