- 专利标题: Process kit having tall deposition ring and deposition ring clamp
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申请号: US15201019申请日: 2016-07-01
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公开(公告)号: US09909206B2公开(公告)日: 2018-03-06
- 发明人: William Johanson , Kirankumar Savandaiah , Adolph Miller Allen , Xin Wang , Prashant Prabhu
- 申请人: APPLIED MATERIALS, INC.
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Moser Taboada
- 代理商 Alan Taboada
- 优先权: IN2029/DEL/2015 20150703
- 主分类号: H01J37/34
- IPC分类号: H01J37/34 ; C23C14/34 ; C23C14/56 ; H01J37/32
摘要:
Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.
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