公开(公告)号：US09953812B2

公开(公告)日：2018-04-24

申请号：US15287675

申请日：2016-10-06

Applicant: APPLIED MATERIALS, INC.

Inventor： William Johanson ,  Kirankumar Savandaiah ,  Xin Wang ,  Prashant Prabhu

IPC: H01J37/34 ,  H01J37/32 ,  C23C14/34 ,  C23C14/56

CPC classification number: H01J37/3441 ,  C23C14/3407 ,  C23C14/564 ,  H01J37/32477 ,  H01J37/32522 ,  H01J37/32642 ,  H01J37/32651

Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes: a one-piece process kit shield having a cylindrical body having an upper portion and a lower portion; an adapter section extending radially outward and having a resting surface to support the one-piece process kit shield on walls of a chamber and a sealing surface on which a chamber lid rests to seal off an inner volume of the chamber when the one-piece process kit shield is placed in the chamber; a heat transfer channel extending through the adapter section; and a protruding section extending radially inward from the lower portion; a resting bracket having an upper portion coupled to the adapter section and a lower portion extending radially inward; a cover ring disposed beneath the protruding section; and a deposition ring disposed beneath the cover ring.

公开(公告)号：US10648071B2

公开(公告)日：2020-05-12

申请号：US15814696

申请日：2017-11-16

Applicant: APPLIED MATERIALS, INC.

Inventor： William Johanson ,  Siew Kit Hoi ,  John Mazzocco ,  Kirankumar Savandaiah ,  Prashant Prabhu

IPC: H01J37/34 ,  C23C14/04 ,  H01J37/32 ,  C23C14/34

Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.

公开(公告)号：US11189472B2

公开(公告)日：2021-11-30

申请号：US15651791

申请日：2017-07-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Irena H. Wysok ,  Kirankumar Savandaiah ,  Anthony Chih-Tung Chan ,  Jiao Song ,  Prashant Prabhu

IPC: H01J37/34 ,  C23C14/35 ,  C23C14/34

Abstract: Embodiments of a magnetron assembly and a processing system incorporating same are provided herein. In some embodiments, a magnetron assembly includes a body extending along a central axis of the magnetron assembly; a coolant feed structure extending through the body along the central axis to provide a coolant along the central axis to an area beneath the coolant feed structure; and a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets.

公开(公告)号：US20190019658A1

公开(公告)日：2019-01-17

申请号：US15651791

申请日：2017-07-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Irena H. Wysok ,  Kirankumar Savandaiah ,  Anthony Chih-Tung Chan ,  Jiao Song ,  Prashant Prabhu

IPC: H01J37/34

Abstract: Embodiments of a magnetron assembly and a processing system incorporating same are provided herein. In some embodiments, a magnetron assembly includes a body extending along a central axis of the magnetron assembly; a coolant feed structure extending through the body along the central axis to provide a coolant along the central axis to an area beneath the coolant feed structure; and a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets.

公开(公告)号：US09909206B2

公开(公告)日：2018-03-06

申请号：US15201019

申请日：2016-07-01

Applicant: APPLIED MATERIALS, INC.

Inventor： William Johanson ,  Kirankumar Savandaiah ,  Adolph Miller Allen ,  Xin Wang ,  Prashant Prabhu

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/56 ,  H01J37/32

CPC classification number: C23C14/3407 ,  C23C14/564 ,  H01J37/32477 ,  H01J37/34 ,  H01J37/3488

Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.