Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit (IC) chip includes a protocol stack comprising a transaction layer which performs operations compatible with a Peripheral Component Interconnect Express™ (PCIe™) specification. Transaction layer packets, exchanged between the transaction layer and a link layer of the protocol stack, are compatible with a PCIe™ format. In another embodiment, a physical layer of the protocol stack is to couple the IC chip to another IC chip for an exchange of the transaction layer packets via single-ended communications. A packaged device includes both of the IC chips.