- 专利标题： Alignment free solar cell metallization
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申请号： US14292280申请日： 2014-05-30
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公开(公告)号： US09911874B2公开(公告)日： 2018-03-06
- 发明人: Gabriel Harley , Taeseok Kim , Benjamin Ian Hsia
- 申请人： SUNPOWER CORPORATION
- 申请人地址： US CA San Jose
- 专利权人： SunPower Corporation
- 当前专利权人： SunPower Corporation
- 当前专利权人地址： US CA San Jose
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224 ; H01L31/18
摘要：
A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a contact finger coupled to the semiconductor region via a plurality of weld regions with at least one of the weld regions being a partial weld.
公开/授权文献
- US20150349154A1 ALIGNMENT FREE SOLAR CELL METALLIZATION 公开/授权日：2015-12-03
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