- 专利标题: DC link module for reducing DC link capacitance
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申请号: US14131259申请日: 2012-07-04
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公开(公告)号: US09912247B2公开(公告)日: 2018-03-06
- 发明人: Shu-Hung Henry Chung , Huai Wang
- 申请人: Shu-Hung Henry Chung , Huai Wang
- 申请人地址: HK Kowloon
- 专利权人: CITY UNIVERSITY OF HONG KONG
- 当前专利权人: CITY UNIVERSITY OF HONG KONG
- 当前专利权人地址: HK Kowloon
- 代理机构: Renner Kenner Greive Bobak Taylor & Weber
- 优先权: WOPCT/CN2011/076955 20110707
- 国际申请: PCT/CN2012/078155 WO 20120704
- 国际公布: WO2013/004180 WO 20130110
- 主分类号: H02M5/458
- IPC分类号: H02M5/458 ; H02M5/42 ; H02M1/14
摘要:
A dc link module for a power circuit includes a first connector for connecting to a first power conversion circuit, a second connector for connecting to a second power conversion circuit, wherein the second power conversion circuit is connected to a load circuit arranged to at least intermittently operate as a power source to the power circuit, at least one dc link capacitors arranged between said first connector and said second connector for processing a voltage signal received at said first connector or said second connector, and at least one voltage compensation circuits arranged between said first connector and said second connector, said one or more voltage compensation circuits arranged to generate a voltage signal to compensate an ac ripple component in a dc voltage signal appearing across the at least one dc link capacitor.
公开/授权文献
- US20140347896A1 DC LINK MODULE FOR REDUCING DC LINK CAPACITANCE 公开/授权日:2014-11-27
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