- 专利标题: Bridging electronic inter-connector and corresponding connection method
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申请号: US15146364申请日: 2016-05-04
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公开(公告)号: US09913376B2公开(公告)日: 2018-03-06
- 发明人: Anthony L. Long , Alexander Parra, II
- 申请人: Northrop Grumman Systems Corporation
- 申请人地址: US VA Falls Church
- 专利权人: Northrop Grumman Systems Corporation
- 当前专利权人: Northrop Grumman Systems Corporation
- 当前专利权人地址: US VA Falls Church
- 代理机构: Patti & Malvone Law Group, LLC
- 主分类号: H01R9/00
- IPC分类号: H01R9/00 ; H05K1/14 ; H05K1/02 ; H05K1/18 ; H05K1/11
摘要:
An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.
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