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公开(公告)号：US10122063B2
公开(公告)日：2018-11-06
申请号：US15013551
申请日：2016-02-02
摘要： A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
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公开(公告)号：US09913376B2
公开(公告)日：2018-03-06
申请号：US15146364
申请日：2016-05-04
CPC分类号： H05K1/144 , H05K1/0237 , H05K1/0243 , H05K1/0253 , H05K1/11 , H05K1/118 , H05K1/141 , H05K1/181 , H05K3/361 , H05K2201/09072 , H05K2201/09281 , H05K2201/09827 , H05K2201/10378 , H05K2201/10886
摘要： An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.
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公开(公告)号：US20190081381A1
公开(公告)日：2019-03-14
申请号：US16149672
申请日：2018-10-02
摘要： A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
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公开(公告)号：US11056760B2
公开(公告)日：2021-07-06
申请号：US16149672
申请日：2018-10-02
摘要： A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
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公开(公告)号：US20170325332A1
公开(公告)日：2017-11-09
申请号：US15146364
申请日：2016-05-04
CPC分类号： H05K1/144 , H05K1/0237 , H05K1/0243 , H05K1/0253 , H05K1/11 , H05K1/118 , H05K1/141 , H05K1/181 , H05K3/361 , H05K2201/09072 , H05K2201/09281 , H05K2201/09827 , H05K2201/10378 , H05K2201/10886
摘要： An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.
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公开(公告)号：US20160149286A1
公开(公告)日：2016-05-26
申请号：US15013551
申请日：2016-02-02
IPC分类号： H01P11/00
CPC分类号： H01P11/006 , C04B35/6269 , H01B3/30 , H01P3/06 , H01P3/08 , H01P3/087 , H01P3/12 , H01P3/121 , H01P11/001 , H01P11/002 , Y10T29/49016 , Y10T29/49018
摘要： A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
摘要翻译： 阐述了制造具有泡沫外壳的电气结构的方法。 泡沫壳体包括形成适于承载通电波形的导电腔的内表面。 当结构的泡沫壳体组装时，电气结构的电气部件与内表面一体地形成。 该方法包括以下步骤：将电镀材料沉积到模具中，将泡沫聚合物注入模具中，并从模具中除去镀覆的泡沫结构物，而不从模具中蚀刻该部分。 该方法还包括以下步骤：将金属形式形成平面结构，用诸如光致抗蚀剂的材料填充泡沫的开孔，从泡沫中加工空腔，将泡沫中的空腔电镀，然后除去光致抗蚀剂 材料。
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