Invention Grant
- Patent Title: Method of manufacturing semiconductor package
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Application No.: US15286828Application Date: 2016-10-06
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Publication No.: US09922846B2Publication Date: 2018-03-20
- Inventor: Seong-chan Han , Young-rock Lee , Chang-kun Kang , Chil-hoon Lee , Han-ju Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2015-0141050 20151007
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/48 ; H01L23/00 ; H01L25/065 ; H01L25/16
Abstract:
A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature.
Public/Granted literature
- US20170103906A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE Public/Granted day:2017-04-13
Information query
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