公开(公告)号：US09922846B2

公开(公告)日：2018-03-20

申请号：US15286828

申请日：2016-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-chan Han ,  Young-rock Lee ,  Chang-kun Kang ,  Chil-hoon Lee ,  Han-ju Kim

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L21/563 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/15323 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature.

公开(公告)号：US20170103906A1

公开(公告)日：2017-04-13

申请号：US15286828

申请日：2016-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong-chan Han ,  Young-rock Lee ,  Chang-kun Kang ,  Chil-hoon Lee ,  Han-ju Kim

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/29

CPC classification number: H01L21/563 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/15323 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip is mounted in the semiconductor chip mounting region. A dam surrounding the semiconductor chip is formed. The formation of the dam includes depositing a first solution having a temperature below a set first temperature. A region under the semiconductor chip and a region defined by the dam are filled with an underfill by depositing the first solution having a temperature equal to or higher than the set first temperature.