Invention Grant
- Patent Title: Film for semiconductor package, semiconductor package using film and display device including the same
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Application No.: US15404110Application Date: 2017-01-11
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Publication No.: US09922891B2Publication Date: 2018-03-20
- Inventor: Soyoung Lim , JaeMin Jung , Jeong-Kyu Ha , Donghan Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renalssance IP Law Group LLP
- Priority: KR10-2015-0000066 20150102
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/66 ; H01L23/00 ; H01L23/498 ; H01L23/66 ; G09G5/00
Abstract:
A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor chip disposed between the first output test pad and the second output test pad on a second surface opposing to the first surface of the insulating film.
Public/Granted literature
- US20170125314A1 FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AND DISPLAY DEVICE INCLUDING THE SAME Public/Granted day:2017-05-04
Information query
IPC分类:
