Invention Grant
- Patent Title: Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device
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Application No.: US15521426Application Date: 2015-10-27
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Publication No.: US09922901B2Publication Date: 2018-03-20
- Inventor: Keisuke Aramaki , Hiroki Kanaya , Masahide Daimon
- Applicant: Dexerials Corporation
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: JP2014-222723 20141031; JP2015-201410 20151009
- International Application: PCT/JP2015/080303 WO 20151027
- International Announcement: WO2016/068157 WO 20160506
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/373 ; B81B3/00
Abstract:
A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.
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