- 专利标题： Shield can, electronic device, and manufacturing method thereof
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申请号： US14640520申请日： 2015-03-06
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公开(公告)号： US09924616B2公开(公告)日： 2018-03-20
- 发明人: Kyunghoon Song , Jungje Bang , Kwangsub Lee , Saebom Lee , Seyoung Jang , Younoh Chi
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Jefferson IP Law, LLP
- 优先权： KR10-2014-0031263 20140317
- 主分类号： H05K9/00
- IPC分类号： H05K9/00 ; H05K7/20 ; H01L23/42 ; H01L23/552
摘要：
A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.
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