公开(公告)号：US09924616B2

公开(公告)日：2018-03-20

申请号：US14640520

申请日：2015-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghoon Song ,  Jungje Bang ,  Kwangsub Lee ,  Saebom Lee ,  Seyoung Jang ,  Younoh Chi

IPC: H05K9/00 ,  H05K7/20 ,  H01L23/42 ,  H01L23/552

CPC classification number: H05K7/20445 ,  H01L23/42 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/12044 ,  H05K9/0032 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.