The invention relates to a process for assembling and repositioning at least two parts by means of a repositionable hot melt adhesive, wherein said parts are held together in assembled position when said adhesive is at a temperature TA and can be repositioned in relation to one another when said adhesive is heated to a temperature TC, wherein said adhesive comprises at least a formulation, which: at the temperature TC has the form of a mixture of polymer chains comprising at least pendant diene units X and of coupling molecules comprising at least two dienophile end groups Y, wherein said X units and said Y groups are arranged to be able to react with one another and to bond together by means of the Diels-Alder reaction at a temperature TDA and to be able to regenerate by means of the retro-Diels-Alder reaction at a temperature TRDA, at a temperature TA has the form of a three-dimensional network, in which the polymer chains are linked to one another by the coupling molecules by means of the Diels-Alder reaction, where TA