- 专利标题: Heat sink structure and LED heat sink assemblies
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申请号: US15166024申请日: 2016-05-26
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公开(公告)号: US09927113B2公开(公告)日: 2018-03-27
- 发明人: Dashiell Birnkrant
- 申请人: KARL STORZ Imaging, Inc.
- 申请人地址: US CA Goleta
- 专利权人: KARL STORZ Imaging, Inc.
- 当前专利权人: KARL STORZ Imaging, Inc.
- 当前专利权人地址: US CA Goleta
- 代理商 Michael Joseph Loi
- 主分类号: F21V19/00
- IPC分类号: F21V19/00 ; F21V29/70 ; H01L33/64 ; H01L33/62 ; G02B23/24 ; F21V5/04 ; A61B1/06 ; F21Y101/02
摘要:
A heat sink includes first and second elongated heat sink bodies. The first and second elongated heat sink bodies are each formed from a respective electrically and thermally conductive material and also each extend from an LED coupling end of the heat sink to a lead end of the heat sink. An electrical insulator material connects the first and second elongated heat sink bodies together so as to bodies are electrically isolated from each other. Each elongated heat sink body also includes a respective LED coupling surface at the LED coupling end of the heat sink and a respective lead connecting surface located on the respective body at a location spaced apart from the LED coupling end of the heat sink.
公开/授权文献
- US20170343203A1 HEAT SINK STRUCTURE AND LED HEAT SINK ASSEMBLIES 公开/授权日:2017-11-30
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