- 专利标题： Multi-chip device with temperature control element for temperature calibration
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申请号： US13511974申请日： 2012-02-27
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公开(公告)号： US09927266B2公开(公告)日： 2018-03-27
- 发明人: Chad S. Dawson , Phillipe Lance , Yizhen Lin , Mark E. Schlarmann
- 申请人： Chad S. Dawson , Phillipe Lance , Yizhen Lin , Mark E. Schlarmann
- 申请人地址： US TX Austin
- 专利权人： NXP USA, Inc.
- 当前专利权人： NXP USA, Inc.
- 当前专利权人地址： US TX Austin
- 国际申请： PCT/IB2012/000510 WO 20120227
- 主分类号： G01K15/00
- IPC分类号： G01K15/00 ; G01K7/00 ; G01D18/00 ; G01D3/036
摘要：
A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.
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