- 专利标题： Leadless electronic packages for GAN devices
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申请号： US15465433申请日： 2017-03-21
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公开(公告)号： US09929079B2公开(公告)日： 2018-03-27
- 发明人: Daniel Marvin Kinzer
- 申请人： Navitas Semiconductor, Inc.
- 申请人地址： US CA El Segundo
- 专利权人： Navitas Semiconductor, Inc.
- 当前专利权人： Navitas Semiconductor, Inc.
- 当前专利权人地址： US CA El Segundo
- 代理机构： Kilpatrick Townsend and Stockton, LLP
- 主分类号： H01L29/15
- IPC分类号： H01L29/15 ; H01L23/495 ; H01L23/31 ; H01L23/00 ; H01L25/07 ; H01L25/16 ; H01L21/56 ; H01L25/065 ; H01L25/00 ; H02M3/158
摘要：
Leadless electronic packages for GaN-based half bridge power conversion circuits have low inductance internal and external connections, high thermal conductivity and a large separation between external connections for use in high voltage power conversion circuits. Some electronic packages employ “L” shaped power paths and internal low impedance die to die connections. Further embodiments employ an insulative substrate disposed within the electronic package for efficient power path routing and increased packaging density.
公开/授权文献
- US20170194237A1 LEADLESS ELECTRONIC PACKAGES FOR GAN DEVICES 公开/授权日：2017-07-06
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