Invention Grant
- Patent Title: Fin shape structure
-
Application No.: US14541085Application Date: 2014-11-13
-
Publication No.: US09929154B2Publication Date: 2018-03-27
- Inventor: Wen-Yin Weng , Cheng-Tung Huang , Wei-Heng Hsu , Yu-Ming Lin , Ya-Ru Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L27/085
- IPC: H01L27/085 ; H01L27/088 ; H01L29/66 ; H01L29/78 ; H01L29/205 ; H01L29/165 ; H01L21/762 ; H01L21/8234 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L21/8258 ; H01L21/02

Abstract:
A fin shaped structure and a method of forming the same. The method includes providing a substrate having a first fin structure and a second fin structure. Next, an insulation material layer is formed on the substrate. Then, a portion of the first fin structure is removed, to form a first recess. Following this, a first buffer layer and a first channel layer are formed sequentially in the first recess. Next, a portion of the second fin structure is removed, to form a second recess. Then, a second buffer layer and a second channel layer are formed in the second recess sequentially, wherein the second buffer layer is different from the first buffer layer.
Public/Granted literature
- US20160141288A1 FIN SHAPE STRUCTURE Public/Granted day:2016-05-19
Information query
IPC分类: