Invention Grant
- Patent Title: Shielded high density card connector
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Application No.: US15074094Application Date: 2016-03-18
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Publication No.: US09929511B2Publication Date: 2018-03-27
- Inventor: John M. Lynch , Chong Richard Zhao , Xiang Li , Donald T. Tran
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R13/6461 ; H01R12/73 ; H01R12/75 ; H01R13/658 ; H01R13/6586 ; H01R12/50 ; H01R13/6585

Abstract:
An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.
Public/Granted literature
- US20170271818A1 SHIELDED HIGH DENSITY CARD CONNECTOR Public/Granted day:2017-09-21
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