Invention Grant
- Patent Title: Bonding structure and method of fabricating the same
-
Application No.: US12774731Application Date: 2010-05-06
-
Publication No.: US09931813B2Publication Date: 2018-04-03
- Inventor: Kuan-Neng Chen , Wei-Chung Lo , Cheng-Ta Ko
- Applicant: Kuan-Neng Chen , Wei-Chung Lo , Cheng-Ta Ko
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: TW99103648A 20100206
- Main IPC: B32B15/01
- IPC: B32B15/01 ; B32B9/04 ; B32B7/04 ; B32B7/12 ; B32B9/00 ; B32B27/28 ; B32B3/08
Abstract:
A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.
Public/Granted literature
- US20110195273A1 BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2011-08-11
Information query
