Invention Grant
- Patent Title: Fluid ejection device
-
Application No.: US15240709Application Date: 2016-08-18
-
Publication No.: US09938136B2Publication Date: 2018-04-10
- Inventor: Teck Khim Neo , Mauro Pasetti , Franco Consiglieri , Luca Molinari , Andrea Nicola Colecchia , Simon Dodd
- Applicant: STMicroelectronics Asia Pacific Pte Ltd , STMicroelectronics S.r.l. , STMicroelectronics, Inc.
- Applicant Address: SG Singapore IT Agrate Brianza US TX Coppell
- Assignee: STMICROELECTRONICS ASIA PACIFIC PTE LTD,STMICROELECTRONICS S.R.L.,STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS ASIA PACIFIC PTE LTD,STMICROELECTRONICS S.R.L.,STMICROELECTRONICS, INC.
- Current Assignee Address: SG Singapore IT Agrate Brianza US TX Coppell
- Agency: Seed IP Law Group LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B05B1/24

Abstract:
The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
Public/Granted literature
- US20180050901A1 FLUID EJECTION DEVICE Public/Granted day:2018-02-22
Information query