- 专利标题: Plasma processing apparatus and upper electrode assembly
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申请号: US14793857申请日: 2015-07-08
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公开(公告)号: US09941101B2公开(公告)日: 2018-04-10
- 发明人: Shin Matsuura , Jun Young Chung
- 申请人: TOKYO ELECTRON LIMITED
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 代理机构: Rothwell, Figg, Ernst & Manbeck, P.C.
- 优先权: JP2014-143293 20140711
- 主分类号: H01J37/32
- IPC分类号: H01J37/32 ; H01L21/3065 ; H01L21/683 ; H05H1/46 ; C23C16/455
摘要:
A plasma processing apparatus includes supporting members, connecting members and a sliding member. Each of the supporting members is partially disposed in a disc-shaped cooling plate and configured to support an upper electrode in a direction of gravity. Each of the connecting members is partially disposed in the cooling plate and extends in a diametrical direction of the cooling plate to be engaged with the corresponding supporting member. The sliding member is configured to slide the connecting members inward in the diametrical direction of the cooling plate, thereby pushing upward the supporting member and lifting the upper electrode to the cooling plate.
公开/授权文献
- US20160013026A1 PLASMA PROCESSING APPARATUS AND UPPER ELECTRODE ASSEMBLY 公开/授权日:2016-01-14
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