- 专利标题： Counter-flow expanding channels for enhanced two-phase heat removal
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申请号： US14976106申请日： 2015-12-21
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公开(公告)号： US09941189B2公开(公告)日： 2018-04-10
- 发明人: Thomas J. Brunschwiler , Timothy J. Chainer , Evan G. Colgan , Arvind Raj Mahankali Sridhar , Chin Lee Ong , Pritish R. Parida , Gerd Schlottig , Mark D. Schultz , Joel A. Silberman
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 L. Jeffrey Kelly
- 主分类号： H01L23/46
- IPC分类号： H01L23/46 ; H01L23/427 ; H01L21/48
摘要：
A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
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