公开(公告)号：US20200118907A1

公开(公告)日：2020-04-16

申请号：US16705278

申请日：2019-12-06

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/427 ,  H01L23/473 ,  H01L21/48

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US11158450B2

公开(公告)日：2021-10-26

申请号：US16442699

申请日：2019-06-17

申请人： International Business Machines Corporation

发明人： Arvind Raj Mahankali Sridhar ,  Thomas Brunschwiler ,  Suiying Ye ,  Luca Del Carro ,  Jens Oliver Ammann

IPC分类号： H01F27/255 ,  H01F1/22 ,  H01F1/24 ,  H01F3/08 ,  H01F41/02 ,  H01F1/37 ,  H01F1/36

摘要： A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

公开(公告)号：US20200091037A1

公开(公告)日：2020-03-19

申请号：US16689445

申请日：2019-11-20

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/427 ,  H01L23/473 ,  H01L21/48

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US10727158B2

公开(公告)日：2020-07-28

申请号：US16689445

申请日：2019-11-20

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/473 ,  H01L23/427 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US09941189B2

公开(公告)日：2018-04-10

申请号：US14976106

申请日：2015-12-21

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/46 ,  H01L23/427 ,  H01L21/48

CPC分类号： H01L23/427 ,  H01L21/4871 ,  H01L23/473 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/15311

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US20170179001A1

公开(公告)日：2017-06-22

申请号：US14976106

申请日：2015-12-21

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/427 ,  H01L21/48

CPC分类号： H01L23/427 ,  H01L21/4871 ,  H01L23/473 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/15311

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US10727159B2

公开(公告)日：2020-07-28

申请号：US16705278

申请日：2019-12-06

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/473 ,  H01L23/427 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US10529648B2

公开(公告)日：2020-01-07

申请号：US15894974

申请日：2018-02-13

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/473 ,  H01L23/427 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US20180182686A1

公开(公告)日：2018-06-28

申请号：US15894974

申请日：2018-02-13

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC分类号： H01L23/427 ,  H01L21/48

CPC分类号： H01L23/427 ,  H01L21/4871 ,  H01L23/473 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/15311

摘要： A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.