A conductive clip for a semiconductor device package. In one example, the conductive clip may include a number of protrusions that extend from a surface of the conductive clip that in practice is solder-mounted to a leadframe of the semiconductor device package. In another example, the conductive clip may include the number of protrusions that each extend from the surface of the conductive clip that in practice is solder-mounted to the leadframe of the semiconductor device package, and may also include a number of protrusions that each extend from a surface of the conductive clip that in practice is solder-mounted to at least one electrical component that in turn is solder-mounted to the leadframe of the semiconductor device package.