The present invention provides an electrical connecting structure between a substrate 21 and a semiconductor chip 22. The electrical connecting structure comprises a metal bump 26 formed on a contact pad 28 of a semiconductor chip 22 and a coating layer 25 formed on the metal bump 26 of the semiconductor chip 22. The coating layer includes material not wettable with solder. The electrical connecting structure further comprises a metal pad 24 formed on the substrate 21. The electrical connecting structure further comprises a solder 29 connecting to a side surface of the metal bump 26 and an outer surface of the metal pad 24. The outer surface is not covered by the coating layer 25.