- 专利标题: Semiconductor device and method of manufacturing semiconductor device
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申请号: US15250972申请日: 2016-08-30
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公开(公告)号: US09941397B2公开(公告)日: 2018-04-10
- 发明人: Takeshi Fujii , Seiji Momota
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kawasaki-Shi, Kanagawa
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kawasaki-Shi, Kanagawa
- 代理机构: Rabin & Berdo, P.C.
- 优先权: JP2014-188682 20140917
- 主分类号: H01L29/739
- IPC分类号: H01L29/739 ; H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L29/06
摘要:
In a trench deeper than a thickness of a p-type base layer and configured by a first trench and a second trench, a second trench positioned at a lower portion is configured by a third trench and a fourth trench. A width of the second trench along an X direction is expanded more than the first trench positioned above the second trench. Along the X direction, the extent to which the second trench is expanded differs for the third trench and the fourth trench. Thus, a width of the lower portion of the trench differs along a Y direction, enabling reduced gate capacitance compared to uniform expansion along a transverse direction of the trench. Further, ON voltage may be reduced and switching capability may be improved.
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