Invention Grant
- Patent Title: Structure and formation method of chip package with fan-out structure
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Application No.: US15195321Application Date: 2016-06-28
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Publication No.: US09947552B2Publication Date: 2018-04-17
- Inventor: Shing-Chao Chen , Chih-Wei Lin , Meng-Tse Chen , Hui-Min Huang , Ming-Da Cheng , Kuo-Lung Pan , Wei-Sen Chang , Tin-Hao Kuo , Hao-Yi Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/48 ; H01L23/31 ; H01L23/58
Abstract:
Structures and formation methods of a chip package are provided. The method includes forming multiple conductive structures over a carrier substrate and disposing a semiconductor die over the carrier substrate. The method also includes disposing a mold over the carrier substrate. The method further includes forming a protection layer between the mold and the carrier substrate to surround the semiconductor die and the conductive structures. In addition, the method includes removing the mold.
Public/Granted literature
- US20170316957A1 STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE Public/Granted day:2017-11-02
Information query
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