- 专利标题: Semiconductor device and method for manufacturing same
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申请号: US13634860申请日: 2010-12-20
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公开(公告)号: US09947782B2公开(公告)日: 2018-04-17
- 发明人: Shin Harada , Makoto Sasaki , Taro Nishiguchi , Kyoko Okita , Keiji Wada , Tomihito Miyazaki
- 申请人: Shin Harada , Makoto Sasaki , Taro Nishiguchi , Kyoko Okita , Keiji Wada , Tomihito Miyazaki
- 申请人地址: JP Osaka-shi
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka-shi
- 代理机构: Venable LLP
- 代理商 Michael A. Sartori; Tamatane J. Aga
- 优先权: JP2010-066197 20100323
- 国际申请: PCT/JP2010/072871 WO 20101220
- 国际公布: WO2011/118104 WO 20110929
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/02 ; H01L21/20 ; H01L29/04 ; H01L29/66 ; H01L29/739 ; H01L29/16
摘要:
A semiconductor device has a semiconductor layer and a substrate. The semiconductor layer constitutes at least a part of a current path, and is made of silicon carbide. The substrate has a first surface supporting the semiconductor layer, and a second surface opposite to the first surface. Further, the substrate is made of silicon carbide having a 4H type single-crystal structure. Further, the substrate has a physical property in which a ratio of a peak strength in a wavelength of around 500 nm to a peak strength in a wavelength of around 390 nm is 0.1 or smaller in photoluminescence measurement. In this way, the semiconductor device is obtained to have a low on-resistance.
公开/授权文献
- US20130009171A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 公开/授权日:2013-01-10
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