Invention Grant
- Patent Title: Integrated process kit for a substrate processing chamber
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Application No.: US15287675Application Date: 2016-10-06
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Publication No.: US09953812B2Publication Date: 2018-04-24
- Inventor: William Johanson , Kirankumar Savandaiah , Xin Wang , Prashant Prabhu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Priority: IN3217/DEL/2015 20151006
- Main IPC: H01J37/34
- IPC: H01J37/34 ; H01J37/32 ; C23C14/34 ; C23C14/56

Abstract:
Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes: a one-piece process kit shield having a cylindrical body having an upper portion and a lower portion; an adapter section extending radially outward and having a resting surface to support the one-piece process kit shield on walls of a chamber and a sealing surface on which a chamber lid rests to seal off an inner volume of the chamber when the one-piece process kit shield is placed in the chamber; a heat transfer channel extending through the adapter section; and a protruding section extending radially inward from the lower portion; a resting bracket having an upper portion coupled to the adapter section and a lower portion extending radially inward; a cover ring disposed beneath the protruding section; and a deposition ring disposed beneath the cover ring.
Public/Granted literature
- US20170098530A1 INTEGRATED PROCESS KIT FOR A SUBSTRATE PROCESSING CHAMBER Public/Granted day:2017-04-06
Information query