- Patent Title: Electronic circuit component mounting method and mounting system
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Application No.: US14769552Application Date: 2013-02-25
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Publication No.: US09955617B2Publication Date: 2018-04-24
- Inventor: Mizuho Nozawa
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/054776 WO 20130225
- International Announcement: WO2014/128968 WO 20140828
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K3/30 ; H05K13/08

Abstract:
A mounting method performed by an electronic circuit component mounting machine that includes a tape feeder which is mounting-machine-main-body-side feeder held by a mounting machine main body, and a bulk feeder which is head-side feeder moved to any position on a movement plane covering a circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder is improved. A reception order is determined, so as to reduce the number of times a mounting head moves between the circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder and the receiving of first type components supplied from the tape feeder and the receiving of second type components supplied from the bulk feeder are respectively performed together as a batch.
Public/Granted literature
- US20160007513A1 ELECTRONIC CIRCUIT COMPONENT MOUNTING METHOD AND MOUNTING SYSTEM Public/Granted day:2016-01-07
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