Invention Grant
- Patent Title: Evaporation method
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Application No.: US15432426Application Date: 2017-02-14
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Publication No.: US09957607B2Publication Date: 2018-05-01
- Inventor: Fu-Ching Tung , Ching-Chiun Wang , Shih-Hsiang Lai
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsin-Chu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Priority: TW103137848A 20141031
- Main IPC: C23C16/54
- IPC: C23C16/54 ; C23C14/54 ; C23C14/28 ; C23C14/24

Abstract:
An evaporation method in this disclosure is adapted for performing an evaporation process upon a surface of an evaporation target substrate. In an embodiment, an evaporation source plate is arranged to be heated by a heater so as to evaporate an evaporation material to its gaseous state, and then enable the gaseous evaporation material to travel passing through holes of a shutter device and thus spread toward the surface of the evaporation target substrate for depositing a film. Moreover, the evaporation method uses a transmission device for controlling the opening/closing of the holes, and there is a heating area formed at a position between the shutter device and the evaporation source plate for allowing the evaporation source plate, the plural holes, the heating area, the evaporation material and the heater to be arranged parallel to one another from the top to bottom.
Public/Granted literature
- US20170159171A1 EVAPORATION METHOD Public/Granted day:2017-06-08
Information query
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