Invention Grant
- Patent Title: Series of electronic components stored in a tape, manufacturing method for series of electronic components stored in a tape, and electronic component
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Application No.: US14872375Application Date: 2015-10-01
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Publication No.: US09961815B2Publication Date: 2018-05-01
- Inventor: Takashi Sawada , Hirotaka Nakazawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-219900 20141029; JP2015-112294 20150602
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H05K13/00 ; H01G4/12 ; H01L41/08 ; H01G4/008

Abstract:
A series of electronic components stored in a tape include a plurality of electronic components each arranged such that a first main surface faces a bottom surface of a cavity. In each electronic component, on a first side surface, a thickness in a width direction of a first terminal electrode at a first main surface side is smaller than a thickness in the width direction of the first terminal electrode at a second main surface side, and on a second side surface, a thickness in the width direction of a second terminal electrode at the first main surface side is smaller than a thickness in the width direction of the second terminal electrode at the second main surface side.
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